Paid
SERVICE DESCRIPTION | The Hysitron TI 990 is a highly advanced nanomechanical and nanotribological characterization tool for measuring mechanical properties—such as hardness, modulus, friction, adhesion, and wear—with high resolution at the nanometer scale. This…
- Laboratorium Mekanika Material dan Struktur - Laboratorium Proses
- KST Serpong (Bacharuddin Jusuf Habibie)
Laboratorium Mekanika Struktur Gd. 225 KST BJ Habibie - BRIN Serpong - 08119811569
- lab.tks@brin.go.id
Marketing Office
Deputi Bidang Infrastruktur Riset dan Inovasi BRIN
layanan_sains@brin.go.id
The Hysitron TI 990 is a highly advanced nanomechanical and nanotribological characterization tool for measuring mechanical properties—such as hardness, modulus, friction, adhesion, and wear—with high resolution at the nanometer scale. This tool is suitable for advanced materials research, thin film development, semiconductor wafer analysis, and applications that require high-precision mapping of mechanical properties.
NANOINDENTATION TEST SAMPLE REQUIREMENTS
1. Sample Size and Shape
- Minimum size: ≥ 5 × 5 mm (recommended ≥ 10 × 10 mm)
- Minimum thickness: ≥ 1–2 mm (for bulk materials)
- Flat, rigid surface, no curvature
2. Surface Conditions (Required)
- Very smooth and flat surface
- Surface roughness (Ra) recommended < 50> - No coarse scratches, large pores, loose particles, or contamination
3. Sample Preparation
- Samples must be polished to smoothness
- Finishing using fine diamond paste (≤ 0.25 µm) or colloidal silica
4. Sample Stability
- Samples must not bend or move during testing
- Fragile materials should be mounted/embedded in hard resin
5. Material Types
- Metals and alloys
- Ceramics and oxides
- Thin films/coatings
6. Cleanliness and Safety
- Samples must be clean, dry, and free of dust/oil
- Must be informed if they contain B3, toxic, corrosive, or radioactive materials
- Radioactive samples must comply with K3 procedures and BRIN permits
7. Specifications for Thin Film/Coating
- Film thickness must be known
- Indentation depth ≤ 10% of film thickness
- Substrate must be hard and stable
8. Technical Information to be Included
- Material type and composition
- Test purpose (hardness, modulus, mapping, etc.)
- Number of indentation points
- Surface condition (polished/unpolished)
- Reporting and data requirements
9. Notes
- Samples that do not meet the requirements may be rejected or require re-preparation.
Application Requirements:
NANOINDENTATION TEST SAMPLE REQUIREMENTS
1. Sample Size and Shape
- Minimum size: ≥ 5 × 5 mm (recommended ≥ 10 × 10 mm)
- Minimum thickness: ≥ 1–2 mm (for bulk materials)
- Flat, rigid surface, no curvature
2. Surface Conditions (Required)
- Very smooth and flat surface
- Surface roughness (Ra) recommended < 50> - No coarse scratches, large pores, loose particles, or contamination
3. Sample Preparation
- Samples must be polished to smoothness
- Finishing using fine diamond paste (≤ 0.25 µm) or colloidal silica
4. Sample Stability
- Samples must not bend or move during testing
- Fragile materials should be mounted/embedded in hard resin
5. Material Types
- Metals and alloys
- Ceramics and oxides
- Thin films/coatings
6. Cleanliness and Safety
- Samples must be clean, dry, and free of dust/oil
- Must be informed if they contain B3, toxic, corrosive, or radioactive materials
- Radioactive samples must comply with K3 procedures and BRIN permits
7. Specifications for Thin Film/Coating
- Film thickness must be known
- Indentation depth ≤ 10% of film thickness
- Substrate must be hard and stable
8. Technical Information to be Included
- Material type and composition
- Test purpose (hardness, modulus, mapping, etc.)
- Number of indentation points
- Surface condition (polished/unpolished)
- Reporting and data requirements
9. Notes
- Samples that do not meet the requirements may be rejected or require re-preparation.
Application Requirements:
- Photo
- Other Supporting File
| File Name | File Size | |
|---|---|---|
| Service SOP/Form file | 0.04 MB | |
| Template Photo | 0 MB | |
| Template Other Supporting File | 0 MB |
