Rp 65.000
DESKRIPSI LAYANAN | Komputer untuk pengerjaan Finite Element Analysis (FEA) berlisensi dari MSC Software Deskripsi : preprocessor and Postprocessor : MSC Patran 2019 Solver : MSC MARC 2019 Komputer ini diperuntukkan untuk pengerjaan komputasi FEA Linear dan Advanced Implicit…
- Laboratorium Struktur, Motor roket dan Avionics
- Direktorat Pengelolaan Laboratorium, Fasilitas Riset, dan Kawasan Sains dan Teknologi
- Bogor - Tarogong
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- labmroket@brin.go.id
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Deputi Bidang Infrastruktur Riset dan Inovasi BRIN
layanan_sains@brin.go.id
Komputer untuk pengerjaan Finite Element Analysis (FEA) berlisensi dari MSC Software
Deskripsi :
preprocessor and Postprocessor : MSC Patran 2019
Solver : MSC MARC 2019
Komputer ini diperuntukkan untuk pengerjaan komputasi FEA Linear dan Advanced Implicit Non-linear simulation, dengan kapabilitas diantaranya :
-Nonlinear analysis that incorporates all forms of nonlinearities (Material, geometric, boundary condition including contact)
-Thermal analysis
-Coupled thermomechanical analysis
-Electromagnetics
-Piezoelectric analysis
-Electrical-Thermal-Mechanical
-Electrostatics and Magnetostatics coupled with structural response
-Manufacturing processes like sheet metal forming, hydroforming, extrusion, blow molding, welding, induction heating, -quenching, curing, cutting etc.
-Piezoelectric analysis with higher order 3D elements
Deskripsi :
preprocessor and Postprocessor : MSC Patran 2019
Solver : MSC MARC 2019
Komputer ini diperuntukkan untuk pengerjaan komputasi FEA Linear dan Advanced Implicit Non-linear simulation, dengan kapabilitas diantaranya :
-Nonlinear analysis that incorporates all forms of nonlinearities (Material, geometric, boundary condition including contact)
-Thermal analysis
-Coupled thermomechanical analysis
-Electromagnetics
-Piezoelectric analysis
-Electrical-Thermal-Mechanical
-Electrostatics and Magnetostatics coupled with structural response
-Manufacturing processes like sheet metal forming, hydroforming, extrusion, blow molding, welding, induction heating, -quenching, curing, cutting etc.
-Piezoelectric analysis with higher order 3D elements